About ICMEM
ICMEM 2027 is the 2027 11th International Conference on Material Engineering and Manufacturing (ICMEM 2027), a materials science conference. It takes place on 28 March 2027 in Osaka, Japan. Full papers are due 10 November 2026.
Full Name: 2027 11th International Conference on Material Engineering and Manufacturing (ICMEM 2027) Abbreviation: ICMEM 2027 **Place: Osaka, Japan **Time: March 28-31, 2027 **Website: https://www.icmem.org/
The ICMEM 2027 aims to gather distinguished academic experts, professional researchers and scholars across the globe to exchange insights, share latest findings and academic achievements covering all dimensions of Materials Science and Advanced Manufacturing. It also serves as a high-level interdisciplinary platform for scholars, industry practitioners and teaching professionals to present, analyze and discuss cutting-edge innovations, prevailing research trends, current academic hotspots, as well as practical technical difficulties faced in relevant fields and effective countermeasures and optimization solutions that have been implemented.
**Publication: Accepted papers will be published in below listed journals of Scientific.Net collection. Indexed by Scopus, Inspec, Google Scholar etc. Defect and Diffusion Forum (DDF) Solid State Phenomena (SSP) Materials Science Forum (MSF) Key Engineering Materials (KEM)
**Past Proceedings ICMEM 2025: Vol. 1027. Key Engineering Materials-ISBN: 978-3-0364-0948-1-Online Linkage | Indexed by Scopus ICMEM 2024: Vol. 155. Advances in Science and Technology-ISBN: 978-3-0364-0643-5-Online Linkage | Indexed by Scopus ICMEM 2023: Vol. 963. Key Engineering Materials-ISBN: 978-3-0364-0434-9-Online Linkage | Indexed by Scopus ICMEM 2022: Vol. 337. Solid State Phenomena-ISBN: 978-3-0364-1171-2-Online Linkage | Indexed by Scopus ICMEM 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1-Online Linkage | Indexed by Ei Compendex & Scopus
**Topics: Track 1: Advanced Manufacturing and Production Engineering Track 2: Smart Manufacturing Systems and Digitalization Track 3: Automation, Robotics and Control Track 4: Materials Science and Engineering Track 5: Nanomaterials, Surface and Functional Materials Track 6: Emerging Materials and Intelligent Technologies
More info., please focus on: https://www.icmem.org/cfp.html
**Submission Method： 1. Please log in the Electronic Submission System to submit your full paper and abstract. https://confsys.iconf.org/submission/icmem2027 2. Send the file as attachment to icmem@cbees.net directly.
**Conference Schedules: March 28, 2027 Reception & Conference Materials Collection March 29, 2027 Opening Remarks, Keynote Speeches and Parallel Sessions March 30, 2027 Invited Speeches and Parallel Sessions March 31, 2027 Social Activity
**Conference Venue: Osaka International Convention Center Address: 5-3-51 Nakanoshima, Kita-ku, Osaka City, 530-0005 Japan
**Contact Us: Conference Secretary: Ms. Rachel Liu E-mail: icmem@cbees.net (Main Contact) Tel.:+852-3155-4897/+86-28-87577778 Wechat: iconf-mse Linked-in: https://www.linkedin.com/in/cms-conference/ Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)
Important dates
- Paper submissionNext
- Conference begins
Topics of interest
Before you submit
- Read the full call for papers — page limits, template (IEEE, ACM, LNCS …) and whether review is double-blind.
- Deadlines are usually 23:59 Anywhere on Earth (AoE) — convert to Bangladesh time (UTC+6) and aim to submit a day early.
- At least one author normally has to register and present; budget for the fee and, for in-person events, a visa appointment well before the conference.
- Look for student travel grants and volunteer programmes — most large conferences run both, with deadlines soon after notification.