Research
Specialisations
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Computational Mechanics
- Aerospace Engineering
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Ion-surface interactions and analysis
- Aluminum Alloy Microstructure Properties
- Publications
- 279
- Citations
- 3.9K
- h-index
- 32
- Papers, last 3 years
- 16
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