Research
Specialisations
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Copper Interconnects and Reliability
- Intermetallics and Advanced Alloy Properties
- Electrodeposition and Electroless Coatings
- Publications
- 126
- Citations
- 3.7K
- h-index
- 31
- Papers, last 3 years
- 11
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