PostDoc position on Wafer Bonding Physics for 3D Chip Integration

About this position

Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently understood. In particular, the interplay between surface properties, wafer morphology, and the resulting bonding performance is still largely optimized empirically.

In this postdoctoral project, you will develop and validate experimental methods to study wafer bonding in a quantitative and physics-based way. You will work on wafer bonding measurements and combine these with advanced surface metrology. It is relevant to have experience with analysis techniques such as AFM, WLI, contact-angle, XPS, infrared metrology.

You will work in the XUV Optics group at the University of Twente, embedded in the MESA+ Institute for Nanotechnology. The project offers a combination of hands-on experimental work, data analysis, physical interpretation and close interaction with industrial partners. You will contribute to a scientifically challenging and industrially relevant topic, with the aiming at predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration.