About MEAP
MEAP 2026 is the 9th International Conference on Mechanical Engineering & Applications, an engineering conference. It takes place on 30 October 2026 online. Full papers are due 26 September 2026.
9th International Conference on Mechanical Engineering & Applications (MEAP 2026)
October 30 ~ 31, 2026, Virtual Conference
Scope & Topics
9th International Conference on Mechanical Engineering & Applications (MEAP 2026) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications impacts and challenges of Mechanical Engineering. The conference documents practical and theoretical results which make a fundamental contribution for the development of Mechanical Engineering. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.
Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to:
Topics of interest include, but are not limited to, the following
Aerospace, Propulsion and Space Systems
Advances in Aerospace Technology Hypersonics, Aerothermodynamics and High‑Speed Flight Advanced Propulsion: Scramjets, RDEs and Hybrid Propulsion Reusable Launch Vehicles and Space Re‑Entry Mechanics Spacecraft Systems, Cryogenic Propulsion and Deep‑Space Engineering Space Robotics, In‑Space Manufacturing and Autonomous Space Systems Aero‑Structures, Aeroelasticity and Morphing Wings Advanced UAV Swarm Dynamics and Cooperative Flight Control Autonomous Vehicles, EV Systems and Hybrid Mobility Transportation Systems, Hyperloop and Next‑Gen Mobility
Robotics, Mechatronics and Autonomous Intelligence
Artificial Intelligence and Expert Systems AI‑Accelerated Engineering, PINNs and Surrogate Modeling Mechanics‑Aware Reinforcement Learning for Robotics Robotics, Mechatronics and Autonomous Systems Soft Robotics, Human–Robot Interaction and Robot Learning Legged Robotics, Dynamic Locomotion and Balance Control Swarm Robotics and Multi‑Agent Mechanical Systems Robotic Manipulation, Dexterous Control and Contact‑Rich Mechanics Autonomous Drone Navigation in Complex Environments
Design, Mechanics and Structural Systems
Design and Reliability of Mechanical Systems Mechanics, Solid Mechanics and Structural Dynamics Fracture Mechanics, Fatigue Life and Structural Integrity High‑Entropy Alloys (HEAs) and Ultra‑High‑Temperature Materials Meta‑Materials, Lattice Structures and Architected Materials Smart Materials, Shape‑Memory Alloys and Active Structures Tribology, Surface Engineering and Coatings Cutting Tool Materials, Coatings and Machinability Smart Structural Health Monitoring (SHM) with Embedded Sensors
Manufacturing, CAD/CAM and Industrial Automation
CAD/CAM, Automation, Control and Robotics Additive Manufacturing, Hybrid Processes and In‑Situ Monitoring Robotic Machining, Adaptive Toolpath Generation and Real‑Time Compensation Manufacturing Processes and Non‑Traditional Machining Industry 4.0, Smart Manufacturing and OT Security Digital Thread, Digital Manufacturing and Lifecycle Integration Zero‑Defect Manufacturing and Real‑Time Quality Control Sustainable Manufacturing and Circular Production Systems Operations Management, Lean Systems and Industrial Optimization
Thermal Sciences, Energy and Sustainability
Thermodynamics and Heat Transfer Fluid Dynamics, Multiphase Flows and CFD Supercritical CO₂ Power Cycles and High‑Efficiency Turbomachinery Hydrogen Propulsion, Hydrogen Combustion and Cryogenic Systems Bio‑Fuels, Hydrogen Energy and Fuel Cells Energy Conservation, Renewable Energy and Sustainable Systems Thermal Management, Batteries and Energy Storage Thermal‑Fluid Optimization for AI Data Centers and Immersion Cooling Triboelectric Nanogenerators and Mechanical Energy Harvesting
Reliability, PHM and Mechanical Systems Engineering
Reliability and Maintenance Engineering Predictive Maintenance, Condition Monitoring and PHM Hybrid PHM (Physics + ML) for Complex Mechanical Systems AI‑Enhanced Fault Detection for Rotating Machinery Lifecycle Reliability Modeling and Digital Maintenance Twins Mechanical Cybersecurity and Secure Mechatronic Systems Logistics, Supply Chain Management and Autonomous Warehousing Total Quality Management and Quality Engineering
Emerging Mechanical Domains
Micro‑Mechanics, MEMS/NEMS and Micro‑Robotics Biomechanics, Human–Machine Interaction and Wearable Systems Human Digital Twins for Ergonomics and Biomechanical Simulation Microfluidics, Lab‑on‑Chip and Bio‑Mechanical Systems Marine Robotics, AUVs and Underwater Soft Robotics Offshore Wind, Ocean Energy and Marine Structures Education in Mechanical Engineering and Future Skills Recent Trends, Breakthroughs and Future Directions Paper Submission
Authors are invited to submit papers through the conference Submission System by September 26, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by The proceedings of the conference will be published by International Journal on Cybernetics & Informatics (IJCI) series (Confirmed).
Selected papers from MEAP 2026, after further revisions, will be published in the special issue of the following journals.
Advances in Materials Science and Engineering : An International Journal (MSEJ) Advanced Mechanical Engineering: An International Journal (MEIJ) Advanced Energy: An International Journal (AEIJ) Mechatronics and Applications: An International Journal (MECHATROJ) Important Dates
Submission Deadline : September 26, 2026 Authors Notification : October 19, 2026 Final Manuscript Due : October 26, 2026
Co - Located Event
4th International Conference on Blockchain, Cybersecurity and Internet of Things (BCYIoT 2026) 4th International Conference on Education & Integrating Technology (EDIT 2026) 4th International Conference on AI, Data Mining and
Important dates
- Paper submissionNext
- Author notification
- Camera-ready
- Conference begins
Topics of interest
Before you submit
- Read the full call for papers — page limits, template (IEEE, ACM, LNCS …) and whether review is double-blind.
- Deadlines are usually 23:59 Anywhere on Earth (AoE) — convert to Bangladesh time (UTC+6) and aim to submit a day early.
- At least one author normally has to register and present; budget for the fee and, for in-person events, a visa appointment well before the conference.
- Look for student travel grants and volunteer programmes — most large conferences run both, with deadlines soon after notification.
