About ICMDA
ICMDA 2027 is the 2027 10th International Conference on Materials Design and Applications (ICMDA 2027), a nanotechnology conference. It takes place on 8 April 2027 in Hiroshima, Japan. Full papers are due 20 November 2026.
* Full Name: 2027 10th International Conference on Materials Design and Applications (ICMDA 2027) * Abbreviation: ICMDA 2027 * Conference Venue: Hiroshima, Japan * Conference Date: April 8-11, 2027 * Conference Website: http://www.icmda.org
* ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications.
* Publication: Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.
Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507) Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779) Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752) Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)
Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.
* History: ICMDA 2025: Vol. 1162. Materials Science Forum-ISBN: 978-3-0364-0958-0 | Indexed by Scopus ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7 | Indexed by Scopus ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7 | Indexed by Scopus ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7 | Indexed by Scopus ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1| Indexed by Ei Compendex & Scopus ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7 | Indexed by Ei Compendex & Scopus ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9 | Indexed by Ei Compendex & Scopus ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0 | Indexed by Ei Compendex & Scopus
* Conference Committee Conference Chairs Takashige Omatsu, Chiba University, Japan
Program Chairs: Masahiro Nomura, The University of Tokyo, Japan Kwang Leong Choy, Duke Kunshan University, China
Technical Program Chairs: Yoshio Kobayashi, Ibaraki University, Japan Anatoly Zinchenko, Nagoya University, Japan Tomoya Oshikiri, Tohoku University, Japan
Publicity Committee: Masayuki Nishi, Kyoto University of Advanced Science, Japan Pengyong Hoo, Universiti Malaysia Perlis (UniMAP), Malaysia Mohanad Alabdullah, Deakin University, Australia Yu-Chih Tzeng, National Central University, Taiwan
...... More info about conference Committees: https://icmda.org/com.html
* Submission Method: System Submission: https://confsys.iconf.org/submission/icmda2027 Email Submission: icmda@cbees.net For more details, you can learn through: https://icmda.org/sub.html
* Call for Paper: Track 1: Materials Design and Computational Engineering Track 2: Advanced Functional Materials and Systems Track 3: Materials Processing and Manufacturing Technologies Track 4: Materials Characterization, Performance and Reliability Track 5: Sustainable Materials and Energy Technologies Track 6: Materials Applications for Intelligent and Emerging Engineering For more information, please visit: http://www.icmda.org/cfp.html
* Contact Us: Conference Secretary: Ms. Lynn Email: icmda@cbees.net Tel: +852-3155-4897/+86-28-87577778 Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)
Important dates
- Paper submissionNext
- Conference begins
Topics of interest
Before you submit
- Read the full call for papers — page limits, template (IEEE, ACM, LNCS …) and whether review is double-blind.
- Deadlines are usually 23:59 Anywhere on Earth (AoE) — convert to Bangladesh time (UTC+6) and aim to submit a day early.
- At least one author normally has to register and present; budget for the fee and, for in-person events, a visa appointment well before the conference.
- Look for student travel grants and volunteer programmes — most large conferences run both, with deadlines soon after notification.