About ICCME
ICCME 2026 is the 2026 the 13th International Conference on Chemical and Material Engineering (ICCME 2026), a chemistry conference. It takes place on 25 November 2026 in Osaka, Japan. Full papers are due 10 October 2026.
Full Name: 2026 the 13th International Conference on Chemical and Material Engineering (ICCME 2026) Abbreviation: ICCME 2026 Venue: Osaka International Convention Center, Osaka, Japan Date: November 25-28, 2026
Official Website: http://www.iccme.org
Highlight: 1. has been held successfully for twelve years. IEEE fellows join the conference as keynote speakers. Last year, we invited IEEE Fellow, Prof. Yusuke Yamauchi from The University of Queensland, Australia to join as the keynote speaker of the conference. 2. Prof. Ramesh K. Agarwal from Washington University in St. Louis (United States) has been the conference chair for 12 years. 3. chemical and material engineering, attracts the entrepreneurs and the institutions, universities to attend the conference; 4. Osaka, is convenient and international for visitors. Moreover, Kyoto is nearby the conference venue. 5. Journal-IJCEA publication. https://www.ijcea.org/ 6. Japanese Visa Assistance service.
13th International Conference on Chemical and Material Engineering will be held in Osaka International Convention Center during November 25-28, 2026. Sponsored by South Asia Institute of Science and Engineering, Washington University in St. Louis, USA; Assisted by Many international institutes.
Publication: All the registered and presented papers will be published in International Journal of Chemical Engineering and Applications. (ISSN 2010-0221 (Print), DOI: 10.18178/IJCEA). Indexed by Chemical Abstracts Services (CAS), Ulrich's Periodicals Directory, CABI, Electronic Journals Library, Google Scholar, ProQuest, Crossref, EBSCO, CNKI.
Submissions Methods: Write your paper according to the publication's request and submit the paper at: ICCME@saise.org OR submitted through http://confsys.iconf.org/submission/iccme2026
Topics of interest include, but are not limited to:
Material Science and Engineering Materials for Energy Harvesting and Storage Materials for Data Storage Materials for Electronic and Optical Applications Concrete Masonry Materials Structural Materials Building Materials Biomaterials Nanomaterials Polymers Composites Synthesis, Properties or Applications of Materials Heat Treatment Processes Testing, Evaluation and Characterization of Materials Geochemistry and Health Chemical Engineering Fundamentals Chemical Engineering Educational Challenges and Development Physical, Theoretical and Computational Chemistry Chemical Reaction Engineering Chemical Engineering Equipment Design and Process Design Catalysis & Reaction
Conference Venue: Osaka International Convention Center
Conference Schedule: (The actual arrangement shall follow the program)
November 25, 2026 09:00-16:00 Registration, collecting conference materials November 26-27, 2026 09:00-12:00 Opening Remarks & Keynote Speeches 13:30-18:00 Parallel Sessions (Oral/Poster Presentations) November 28, 2026 10:00-16:00 Parallel Sessions / Visit / Tour
For any inquiry about the conference, please feel free to contact: Ms. Lucia Yang Email: ICCME@SAISE.ORG Hotline: +86-15008402564 (China) / +852-36789835 (HK) WeChat: iconf-mse (Please leave message "ICCME2026")
Conference Venue: Osaka International Convention Center Address: 5-3-51 Nakanoshima, Kita-ku, Osaka City, Osaka Prefecture, 530-0005 Japan
Important dates
- Paper submissionNext
- Conference begins
Topics of interest
Before you submit
- Read the full call for papers — page limits, template (IEEE, ACM, LNCS …) and whether review is double-blind.
- Deadlines are usually 23:59 Anywhere on Earth (AoE) — convert to Bangladesh time (UTC+6) and aim to submit a day early.
- At least one author normally has to register and present; budget for the fee and, for in-person events, a visa appointment well before the conference.
- Look for student travel grants and volunteer programmes — most large conferences run both, with deadlines soon after notification.
