ELE 2026: 10th International Conference on Electrical Engineering

10th International Conference on Electrical Engineering (ELE 2026)

October 30 ~ 31, 2026, Virtual Conference

Scope & Topics

10th International Conference on Electrical Engineering (ELE 2026) aims to bring together researchers and practitioners from academia and industry to focus on recent systems and techniques in the broad field of Electrical Engineering. Original research papers, state-of-the-art reviews are invited for publication in all areas of Electrical Engineering.

Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to:

Topics of interest include, but are not limited to, the following

Communication and Networking

Communication Systems and Wireless Technologies 5G/6G Networks, Massive MIMO and THz Communications Reconfigurable Intelligent Surfaces (RIS) for 6G Semantic Communications and Goal‑Oriented Networking Integrated Sensing and Communication (ISAC) AI‑Native Wireless Networks and Neural Modulation Cell‑Free Massive MIMO and Distributed Antenna Systems IoT, Edge Networks and Cyber‑Physical Connectivity Satellite, UAV and Non‑Terrestrial Networks Open RAN (O‑RAN) and Virtualized Radio Access Networks Quantum‑Safe Communication and Post‑Quantum Cryptography Network Security, Privacy and Resilient Communication

Control, Automation and Robotics

Control Systems and Intelligent Automation Robotics, Mechatronics and Autonomous Systems Distributed Control for Multi‑Robot Systems Safety‑Critical Control for Autonomous Systems AI‑Driven Motion Planning and Safe Autonomous Navigation Nonlinear, Adaptive and Robust Control Electrified Soft Actuators and High‑Power Robotics Drives Robotics for Extreme Environments Robotics‑Integrated Power Electronics Cyber‑Physical Systems, Digital Twins and Industrial Automation

Electromagnetics, Photonics and Quantum Technologies

Electromagnetics, RF Systems and Microwave Engineering Photonics, Optoelectronics and Photonic Integrated Circuits Silicon Photonics and CMOS‑Compatible Photonic ICs Topological Photonics and Protected Light Transport Antennas, Wave Propagation and Metamaterials Quantum Devices, Quantum Sensors and Quantum Communication Quantum Photonics and Integrated Quantum Circuits Quantum RF Systems and Cryo‑Microwave Engineering High‑Frequency Devices and Terahertz Systems Optical Neural Networks and Photonic AI Accelerators Inverse Design for Photonics and EM Structures High‑Power Microwave Systems and Directed Energy

High Voltage, Power Electronics and Power Systems

High Voltage Engineering and Insulation Systems Power Electronics, Converters and Drives Wide‑Bandgap Devices (GaN, SiC) for High‑Efficiency Power Conversion AI‑Driven Power Converter Design and Digital Control EV Power Electronics, Charging Systems and Mobility Electrification Power Electronics for Fusion Reactors Smart Grids, Grid Resilience and Renewable Integration Grid‑Forming Inverters and Future Power Grid Stability Resilient Microgrids and Autonomous Grid Restoration Power Systems Protection, Stability and Optimization Solid‑State Transformers and Smart Substations Energy Storage, Battery Management and Power Quality Electrified Transportation Infrastructure and Vehicle‑to‑Grid (V2G) High‑Frequency Power Conversion (MHz‑Range)

Signal Processing, Systems Science and Imaging

Systems Science and Signal Processing AI‑Accelerated Signal Processing and Edge Intelligence Spiking Neural Signal Processing and Event‑Based Sensing Graph Signal Processing and Networked Data Analysis Multimodal Sensing Fusion (RF + Vision + Audio) RF‑Vision Fusion (Radar + Vision Transformers) Image Processing, Multimedia and Computer Vision Computational Imaging and Compressive Sensing Biomedical Imaging, Medical Signal Analysis and Diagnostics Speech, Audio and Acoustic Signal Processing AI‑Driven Spectrum Sensing and Cognitive Radio 2.0 AI‑Driven Compression, Coding and Multimedia Systems

Nano Devices, Integrated Systems and Emerging Electronics

Nano Devices, Nanoelectronics and Integrated Systems Semiconductor Devices, VLSI and Advanced IC Design 3D ICs, TSVs and Heterogeneous Integration Chiplet Architectures and Advanced Packaging Cryogenic Electronics for Quantum Computing Quantum‑CMOS Co‑Design and Hybrid Classical–Quantum Chips Ferroelectric FETs (FeFETs) and Next‑Gen Non‑Volatile Memory Spintronics, Magnetic Memory and MRAM In‑Memory Computing and Analog AI Accelerators Flexible Electronics, Wearable Sensors and Bio‑Integrated Devices Electronic Packaging, Reliability and Thermal Management

Instrumentation, Embedded Systems and Industrial Electronics

Measurements, Instrumentation and Sensor Systems High‑Precision Metrology and Quantum Sensors Digital Metrology and AI‑Enhanced Calibration Embedded Systems, Real‑Time Systems and FPGA Applications Ultra‑Low‑Power Analog Front‑Ends for Edge AI Industrial Automation, SCADA and Process Control Electromechanical Systems and Industrial Electronics Industrial IoT, SCADA Security and OT Cyber‑Resilience Digital Twins for Industrial Monitoring

Emerging Electrical Engineering Domains

Cybersecurity for Electrical and Industrial Systems Electromagnetic Compatibility (EMC) and Interference Mitigation Sustainable Energy Systems and Electrification Technologies AI for Electrical Engineering, Optimization and Automation Recent Trends, Breakthroughs and Future Directions Paper Submission

Authors are invited to submit papers through the conference Submission System by September 26, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by The proceedings of the conference will be published by International Journal on Cybernetics & Informatics (IJCI) series (Confirmed).

Selected papers